At Skultuna Induflex we take on new challenges, inventing flexible laminating solutions in a wide range of products, finding ways to make people’s everyday life easier. With our long history of research, experience with lamination, know-how and skill, we continously work on innovating lighter, smarter and more environmentally friendly flexible laminate products, optimizing function and performance.

That curiosity led us to finding solutions to roll to roll etch-able materials with a special bonding technique between carrier and metal. If successful the etched cirquits could be put on any substrate using transfer technique. The result could be tearable electronic paper tickets, sewable and super flexible cirquits in cloths, thin cirquits or totally transparent for LED-luminated glass – just to name a few possible applications.

Peeling strength is key

Skultuna Induflex has in cooperation with Mid Sweden University (MIUN) and Backer Calesco developed and come up with a new method to produce paper or nonwoven etched electronics based on foil by laminating in roll-to-roll production.

– The process showed that it was important to have the right peel strength between metal and substrate, yet low enough peel strength between metal and carrier, Robert Öhman, head of R&D at Skultuna Induflex, explains.

One of the many challenges was to balancing the peel strength between the metal and carrier – strong enough not to delaminate during the process, yet easy to remove after laminating on to the substrate, paper or nonwowen textile. The end result is paper or textile electronic cirquits based on foil, making it possible for customers to solder or glue components to a highly flexible cirquit.

Successful flexible paper and fabric lamination solutions

Testing the etched flexible cirquits indicated success. Together with MIUN Skultuna Induflex made prototypes with copper, aluminum, paper and nonwowen fabric. After Skultuna Induflex made the lamination, MIUN added components on aluminum and copper paper laminates. This went very well using the soldering process. The nonwowen fabric laminates had to be glued, otherwise the fabric would melt from the heat during soldering.

Even though the flexible laminating solutions were a success, some challenges remains to be solved – one is how to remove the adhesive layer on top of  metal which is a prerequisite when  adding components by soldering or glue.

– I think this type of research and invention is a key factor to success – using curiosity and imagination to methodical work. And we will solve the new challenges too, concludes Robert Öhman.