Technical laminates for flexible circuits
Skultuna Induflex develops and manufactures a complete range of Cu-based laminates for the Near Field Communication (NFC) and Flexible Printed Circuits (FPC) industries. We offer a specific range of laminates with high end adhesive systems which can be successfully etched to produce flexible circuits. With dedicated and sensitive manufacturing equipment, roll to roll consistency is maintained within tightly defined limits.
Laminates for flexible circuits require support that guarantees flatness and dimensional stability as well as they need to manage mechanical stress and harsh environments. Skultuna Induflex meets these requirements by using different type of plastic films such as PEN, PI and heat stabilized PET according to customers’ demands.
Our cover materials are used for, among other things, protection of circuits and correspond to our other laminates for flexible circuits. We have the possibility to make cover materials with different thicknesses and heat sealable layer upon customers’ requests.
Skultuna Induflex is known for developing advanced customized flexible technical laminates
for more information about our capabilities